A: Perhaps it is time for you to consider a next generation no-flow product which will still bond aggressively but will have a higher Tg and be rated UL-94 V0.
Arlon produces epoxy and polyimide no- flow products engineered for various heat sink bonding applications and with several available flow values for processing flexibility.
The optimum product for your application is Arlon’s 47N no-flow prepreg. A tetrafunctional modified epoxy, 47N is characterized by robust adhesion to a variety of surfaces, has a Tg of 130oC and is rated UL-94 V0. In use in a variety of applications including sensor boards for ABS systems in automobiles, 47N can be cured at temperatures as low as 300oF (150oC) and pressures as low as 100 psi, depending on the board configuration.
Arlon has also recently introduced 99N No-Flow, ceramic filled, thermally conductive prepreg, which is designed to provide substantially greater thermal conductivity (1.2 W/m-K+) than conventional unfilled no-flow materials. If heat transfer is an issue, consider evaluating this product as well. In addition to the above products, Arlon offers a full line of polyimide and epoxy based no-flow products for a wide variety of applications including heat-sink bonding and rigid-flex. |
