Electronic Substrates
Q: I am designing a PWB for a high power DC to DC converter. With a large array of solid state switches, heat generation will be a big issue. Are there board materials that can help with managing the heat?
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Q: I am producing multilayer PWB's for a variety of backplane and mother board applications and have recently been advised of a requirement for boards to be built using lead-free solder. Should I be concerned about Tg, Decomposition temperature or both as I fab these boards?
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Q: We are looking for a material to be able to form laser microvias that also has CTE control for leadless component attach reliability and is capable of passing a 1 meter drop impact test for handheld personal electronics. What do you recommend?
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Q: We are trying to design reduced-cost polyimide flex-rigid products for applications requiring bend to fit but that don’t necessarily need to undergo dynamic flexure. Do you have any suggestions?
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Q: We are using a high tack no flow product, but it is not flame retardant and customers are requiring a UL listed product. Our application is heat sink bonding and we prefer to continue to use a low temperature and pressure cure. What can you suggest?
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Microwave Materials
Q: I am designing antennas for 3G cellular applications and I need a lightweight, low cost material with excellent PIM characteristics for a wide bandwidth project. What do you suggest?
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Q: I am designing a power amp for a wireless base station application and need improved thermal conductivity to handle the heat being generated. What materials do you recommend that are cost effective?
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Q: I have been tasked to miniaturize a low noise amp for a cellular repeater system and want to use a high dielectric constant soft substrate material as ceramics are too brittle for my application. What material issues should I be aware of and what can you suggest as a starting point for my application?
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Q: My military application requires low loss characteristics of PTFE over a wide temperature range. The application is very sensitive to the dielectric constant changes across temperature and must be multilayerable. Any suggestions?
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