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Electronic Substrates

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Polyimides

Resin

Product Description

Tg (°C)*

CTE (Z) %

UL-94 Rating

Td 5% (°C)

H2O Absorp

Tc (W/m-K)

IPC4101 Class

Comments

EP2

Enhanced Polyimide

250

0.6

V0

424

0.16

0.45

GIL /40 /41

Filled, Low Z Expansion

33N

Flame Retardant Polyimide

250

1.2

V0

389

0.21

0.20

GIL /40 /41

Max Flame Retardance

35N

General Purpose Polyimide

250

1.2

V1

407

0.26

0.20

GIL /40 /41

Reduced Cure Time

85N

Best-in-Class High Temp Polyimide

250

1.2

HB

407

0.27

0.20

GIL /40 /41

Optimum Long Term Stability

84N

Multifilm Filled Polyimide

250

1

Meets HB

407

0.3

0.25

GIL /40 /41

For Via/Clearance Hole Filling

HF-50

Powdered Poly Hole Fill Compound

250

0.55

n/a

>400

0.4

0.50

N/A

Fill Compound

* PolyimideTg measured by Thermomechnical Analysis (TMA)

Low Flows

Resin

Product Description

Tg (°C)*

CTE (Z) %

UL-94 Rating

Td 5% (°C)

H2O Absorp

Tc (W/m-K)

IPC4101 Class

Comments

37N

Low Flow Polyimide Prepreg

200

2.3

Meets V0

340

<1.0

0.30

GIJ /42

Rigid Flex Applications

38N

2nd Gen Low Flow Polyimide Prepreg

200

1.5

Meets V0

330

<1.0

0.30

GIJ /42

Enhanced Rheology Rigid Flex

51N

Lead-Free Epoxy Low Flow

170

2.6

V0

368

0.15

0.25

GFG /124

Lead-Free Solderable, Rigid-Flex

49N

Multifunctional Epoxy Low Flow

170

3.1

>V0

>302

0.1

0.25

GFG /24

Rigid-Flex, Heat Sinks

47N

Modified Epoxy Low Flow

135

3.5

V0

315

0.15

0.1

GFG /21

Heat Sink Bond, Low Temp Cure

Thermally Conductive

Resin

Product Description

Tg (°C)*

CTE (Z) %

UL-94 Rating

Td 5% (°C)

H2O Absorp

Tc (W/m-K)

IPC4101 Class

Comments

91ML

Lead-Free, Halogen Free Epoxy

170

2.6

V0

368

0.13

1.00

GFG /98

Tc (X,Y) = 1.9 W/m-K

92ML

Lead-Free, Halogen Free Epoxy

170

1.8

V0

400

0.12

2.00

GFG /98

Tc (X,Y) = 3.5 W/m-K

MultiClad HF

Product

Dk (10 GHz)

Df (10 GHz)

TCEr* ppm/°C

CTE (X/Y) ppm/°C

CTE(Z) ppm/°C

H2O Absorp

Tc (W/m-K)

IPC4103 Class

Comments

MultiClad HF©

3.70

0.0045

75

14, 16

20

0.1

0.64

/250

Halogen-Free, Low-Loss

Epoxy

Resin

Product Description

Tg (°C)*

CTE (Z) %

UL-94 Rating

Td 5% (°C)

H2O Absorp

Tc (W/m-K)

IPC4101 Class

Comments

45N

Multifunctional Epoxy

170

2.4

V0

>300

0.1

0.25

GFG /24

High Layer Count MLB's

44N

Multifilm Filled Epoxy

170

2.2

V0

>300

0.1

0.30

GFG /24

For Via/Clearance Hole Fill

* Epoxy Tg measured vy Differential Scanning Calorimeter (DSC)

Surface Mount/HDI

Resin

Product Description

Tg (°C)*

CTE (Z) %

UL-94 Rating

Td 5% (°C)

H2O Absorp

Tc (W/m-K)

IPC4101 Class

Comments

45NK

Woven Aramid Reinforced Epoxy

170

2.8

V0

>300

0.8

0.22

AFN /50

 

55NT

Epoxy Nonwoven Aramid

170

3.5

V0

368

0.3

0.20

BFG /55

 

85NT

Polyimide Nonwoven Aramid

250

2.3

N/A

426

0.6

0.20

BIL /53

 

85N/CIC

Polyimide Clad with CIC

250

1.5

HB

407

0.2

0.27

GIL /40 /41

CIC = Copper-Invar-Copper