|
Product
|
Dielectric
Constant
|
Dissipation
Factor
|
Type
IPC-4103
|
Processing
Guidelines
|
|
CLTE PRODUCT
FAMILY (Highest degree of Performance)
|
|
CLTE-XT
|
2.94
± 0.03
|
0.0012
|
/06
|
CLTE,CLTE-LC & CLTE-P
Processing
|
|
CLTE-AT
|
3.00
± 0.04
|
0.0013
|
/06
|
|
CLTE
|
2.96
|
0.0023
|
/06
|
|
Highest Dk Stability vs. Temperature - Critical for Phase
Sensitive Applications
High Performance
Laminates for Avionics, Radars, CNI and Phase Sensitive Filters
Reinforced PTFE
with microdispersed Ceramic
|
|
|
|
|
|
|
|
TC PRODUCT
FAMILY (Thermally Conductive, Temperature Phase Stable)
|
|
TC350
|
3.50
± 0.05
|
0.0020
|
/09
/16
|
TC Series
Processing Guidelines
|
|
TC600
|
6.15
± 0.15
|
0.0020
|
/07
|
|
High Thermal
Conductivity, Temperature Phase Stable, Low CTE Laminates.
Excellent for Heat Dissipation, reduces Junction Temperatures, improves
device and solder joint reliability. Excellent for Power
Amplifiers and Antennas Sensitive to Dielectric Constant changes with
Temperature
|
|
|
|
|
|
|
|
Next Generation of Lower
Loss Materials, Available with PIM+ Technology
|
|
AD255A
|
2.55
± 0.04
|
0.0015
|
N/A
|
AD Series Processing Guidelines
|
|
AD260A
|
2.60
± 0.04
|
0.0017
|
N/A
|
|
AD300A
|
3.00
± 0.04
|
0.002
|
/09
|
|
AD320A
|
3.20
± 0.04
|
0.0032
|
/09
|
|
Scroll
down for Original AD Series Products.
"AD "A" Series"
Products are not Available below 0.020"
Typical thicknesses include
0.030", 0.031", 0.040", 0.060", and
0.062". Inquire for thicker laminates
|
|
|
|
|
|
|
|
PTFE and Microdispersed
Ceramic reinforced with Commercial Grade Glass
|
|
AD350A
|
3.50±
0.05
|
0.003
|
/09,
/16
|
AD Series Processing
Guidelines
|
|
AD410
|
4.10
|
0.003
|
/16
|
|
AD430
|
4.30
|
0.003
|
/16
|
|
AD450
|
4.50
|
0.0035
|
/16
|
|
AD1000
|
10.2
|
0.0023
|
/08
|
AD1000 Processing
Guidelines
|
|
|
|
|
|
|
|
Traditional Products -
High PTFE to Glass Ratio, Lowest Loss
|
|
|
Woven Fiberglass Reinforced
PTFE - Unidirectional Plies
|
|
|
DiClad
522
|
2.40
- 2.60 ± 0.05
|
0.001
|
GT
/01
|
DiClad Series Processing Guidelines
|
|
DiClad
527
|
2.40
- 2.60 ± 0.04
|
0.0018
|
GX
/02
|
|
DiClad
870
|
2.33
± 0.02
|
0.0013
|
GY
/05
|
|
DiClad
880
|
2.17,
2.20 ± 0.02
|
0.0009
|
GY
/05
|
|
|
|
|
|
*
Mil-S-13949 inactivated
|
|
Traditional Products -
High PTFE to Glass Ratio, Lowest Loss
|
|
|
Woven Fiberglass Reinforced
PTFE - Crossplied
|
|
|
|
CuClad
250GT
|
2.40
- 2.60 ± 0.05
|
0.001
|
GT
/01
|
CuClad Series Processing Guidelines
|
|
CuClad
250GX
|
2.40
- 2.60 ± 0.04
|
0.0018
|
GX
/02
|
|
CuClad
233LX
|
2.33
± 0.02
|
0.0013
|
GY
/05
|
|
CuClad
217LX
|
2.17,
2.20 ± 0.02
|
0.0009
|
GY
/05
|
|
|
|
|
|
*
Mil-S-13949 inactivated
|
|
Traditional Products - High
PTFE to Glass Ratio, Lowest Loss
|
|
|
Non-Woven Reinforced
PTFE
|
|
|
|
|
IsoClad
917
|
2.17
± 0.04
|
0.0013
|
GP,
GR /03, 04
|
IsoClad
Series Processing Guidelines
|
|
IsoClad
933
|
2.33
± 0.04
|
0.0016
|
GP,
GR /03, 04
|
|
|
|
|
|
*
Mil-S-13949 inactivated
|
|
|
|
|
|
|
|
Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
|
|
25N
|
3.38
± 0.06
|
0.0025
|
/10
|
25N/FR
Processing Guidelines
|
|
25FR
|
3.58
± 0.06
|
0.0035
|
/11
|
|
|
|
|
|
|
|
Reduced Passive Intermodulation (PIM) Laminates
|
|
DiClad 880-PIM
|
2.17,
2.20 ± 0.02
|
0.0009
|
GY
/05
|
PIM Series Data Sheet
|
|
AD Series PIM
|
2.50
- 3.50
|
0.002
-0.003
|
/09
|
|
AD "A" Series PIM+ Technology available from 2.55
to 3.20 (see above)
|
|
|
|
|
|
|
|
Legacy, Low Cost Commercial
Based Laminates
|
|
Next Generation Alternatives
may be available (see above offerings or inquire for details)
|
|
AD250
|
2.50
|
0.0017
|
/02
|
AD Series
Processing Guidelines
|
|
AD255
|
2.55
|
0.0018
|
/02
|
|
AD270
|
2.70
|
0.0023
|
/09
|
|
AD320
|
3.20
|
0.0038
|
/09
|
|
AD600
|
6.15
|
0.003
|
/07
|
AD600 Processing
Guidelines
|
|
AR1000
|
9.8
|
0.003
|
/08
|
AR1000 Processing
Guidelines
|
|
|
|
|
|
|
|
Thermoplastic Bonding Films
for Stripline and Multilayer Packages
|
|
CuClad
6250
|
2.32
± 0.10
|
0.0013
|
/15
|
CuClad 6250/6700 Data/Processing
|
|
CuClad
6700
|
2.35
± 0.10
|
0.0025
|
/15
|
|
CLTE-P
|
2.94
|
0.0025
|
/06
|
CLTE,CLTE-LC & CLTE-P
Processing
|
|
|
|
|
|
|
|
|
|
