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Rancho Cucamonga, CA (January 18, 2008) – Arlon announced that it has released the Arlon 91ML cost effective thermally conductive multifunctional epoxy laminate and prepreg products. 91ML is currently the only thermally conductive FR-4 product that is compatible with Lead-Free Solder processes. It also offers “Best-in-Class” Thermal Resistance (a combination of thickness divided by thermal conductivity). The 91ML laminate and prepreg products provide a low-cost, lead-free solder compatibility system with enhanced heat transfer characteristics for multilayer PWB’s for applications requiring thermal management throughout the entire board volume. Typical applications include High Brightness LED’s, DC-DC Power Converters and Automotive Electronics.
For thermal management, the thermal effectiveness of 91ML can be seen in its “Best-in-Class” Thermal Resistance, This accounts for the combined affects of both thickness and thermal conductivity. 91ML has thru-plane Thermal Conductivity 1.0 W/m-K and in-plane Thermal Conductivity of 2 W/mK, and is available in prepreg thicknesses as thin as 0.003". Unlike most thermally conductive PCB materials on the market, 91ML has excellent thermal stability for lead-free solder temperatures, such as a high decomposition temperature of >350°C and "Best-in-class" thermal performance with T260>60 minutes, T280>30 minutes and T300 > 10 minutes.
Download 91ML Datasheet
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