| DiClad Series - unidirectional woven fiberglass / PTFE laminates available in a range of Dk’s (2.17 to 2.6) and loss values (0.0009 to 0.0022).
Lowest Loss Products. CuClad Series - cross-plied woven fiberglass / PTFE laminates available in a range of Dk’s (2.17 to 2.6) and loss (0.0009 to 0.0022). The sequential layers of fabric are cross-plied to ensure in-plane isotropy for applications requiring matched electrical properties in the X-Y plane.
Lowest Loss Products.
IsoClad Series – non-woven glass / PTFE laminates available in a range of Dk’s (2.17, 2.33) and loss (0.0013-0.0016). These materials offer lower modulus permitting a more flexible thin laminate than is typical with a woven glass reinforced product.
Excellent for formable/bendable antennas. Low Loss
Products.
CLTE Series – woven-glass / PTFE / microdispersed ceramic
laminates. CLTE offers highest Dk (2.94) Stability vs. Temperature critical
for Phase Sensitive Applications. Very Low CTE Values. Excellent
dimensional stability; ideal for thin core, multi-layer boards; highest
degree of embedded resistor consistency in the industry. High
Performance Laminates for Avionics, Radars, EW, SIGINT, CNI (Communications,
Navigation, Identification), and Phase Sensitive Filters.
PTFE reinforced with Commercial Grade Glass (AD250 through AD320) -
Range of Dk’s (2.5-3.2) and loss (0.0018 – 0.003). These are Arlon's
low cost PTFE products that nonetheless retain the frequency stable dielectric properties of Teflon.
PTFE and micro dispersed ceramic reinforced with Commercial Grade Glass
(AD260A through AD450) - Range of Dk’s (2.6-4.5) and loss (0.0018 – 0.0035).
Low Cost.
Higher Dielectric Constant, Reinforced PTFE with micro dispersed Ceramic
- AD600 and AD1000 - Dk of 6.15 and 10.2. Low Loss. Ideal
for microwave circuit miniaturization.
DiClad-PIM and AD-PIM Series – these special DiClad and AD series constructions are designed to minimize Passive Intermodulation Distortion
that is important to antenna systems.
Non-PTFE Low Loss, 25N and 25FR – a homogenous laminate and prepreg system, processable in a conventional FR-4 process. Dk’s and loss are 3.38, 3.58 and 0.0025, 0.003 respectively.
Bonding Materials - thermoplastic bonding materials for producing multilayer PTFE circuit boards or bonding PTFE boards to heatsinks or FR-4 boards.
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Polyimide Products – woven glass / polyimide laminate and prepreg materials for use where high temperature resistance is required for manufacturability, field repairability, or high temperature service environments. In addition, No-Flow prepregs are available for rigid flex applications
Epoxy Products – woven glass / high Tg multifunctional laminate and prepreg materials as well as a no-flow and low flow epoxy products for heat sink bonding and epoxy rigid-flex applications.
Thermally Conductive Products - ceramic-filled, woven glass / epoxy laminate and prepreg materials designed for multilayer PWBs and heatsink bonding with improved thermal conductivity over conventional FR-4 materials, yet processing like FR-4.
Controlled Thermal Expansion, Thermount® Products – non-woven aramid reinforced laminate and prepreg systems designed for PWB's for surface mount technology where the CTE of the laminate needs to be close to that of the device being mounted to minimize solder stress due to unequal movement of materials. Available with both epoxy and polyimide resins.
HDI/Microvia/CAF Resistant, Thermount® Products –non-woven aramid reinforced laminate and prepreg systems designed for PWB's where laser microvia formation is a key element of PWB design. Available with both epoxy and polyimide resins. |
